Diffusion bonding Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Interface observation of diffusion bonding using CORE-X technology: An example of SUS420J2 series.

A new technology that combines diffusion bonding to enhance the strength of joints and significantly reduce voids. Verification of interfacial observation results in SUS420J2 series!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for a process called 'diffusion bonding,' and by combining this with our new technology 'CORE-X technology,' we can enhance the strength of the bonded area and significantly reduce voids. [Test Results with STAVAX (SUS420j2 Series)] In cases where only conventional diffusion bonding was used, there were many voids and insufficient strength. However, by applying 'CORE-X technology' along with quenching and tempering, we achieved high strength. Additionally, in fracture tests, no fractures occurred at the joint, demonstrating high strength. ◆ Please also take a look at the photo in the top left corner of the page! ◆ We are currently offering a document summarizing test results and technical data for various materials. Please check it out via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Joining of dissimilar materials using CORE-X technology: A case study of Fe and Cu.

A new technology that strengthens the bonding between different materials and significantly reduces voids. Verification of dissimilar material joints using Fe and Cu!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for 'diffusion bonding' and combine it with our new technology 'CORE-X technology' to achieve high strength at the joint when bonding dissimilar materials, significantly reducing voids. [Bonding of Dissimilar Materials with Fe and Cu] The photo at the top left of this page shows the bonding of Fe and Cu using our technology. The joining surfaces are closely adhered, demonstrating high strength. ◆ We are currently offering a document summarizing test results and technical data for various materials. Please view it via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Joining of dissimilar materials using CORE-X technology: Example of SUS series + Cu.

A new technology that strengthens the bonding between different materials and significantly reduces voids. Verification of dissimilar material joints using SUS and Cu!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for 'diffusion bonding' and combine it with our new technology 'CORE-X technology' to achieve high strength at the joint when bonding dissimilar materials, significantly reducing voids. The photo at the top left of this page shows the bonding of SUS series and Cu using our technology. The joining surfaces are closely adhered, demonstrating high strength. We are currently offering a document summarizing test results and technical data for various materials. Please view it via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Introduction of bond strength test result data for joints using CORE-X technology.

A new technology that enhances the bonding area of the joint to high strength and significantly reduces the gaps. We will introduce the bonding strength test results with various materials through photos.

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion that occurs between joining surfaces for 'diffusion bonding' and combine it with our new technology 'CORE-X technology' to enhance the strength of the joint and significantly reduce voids. 【What happened to the bonded test specimens after various tensile tests?】 The photo at the top left of this page shows the results of the tensile tests. In each material, the bonding interface was not cut, but the base material itself was severed. This demonstrates the high strength achieved through our bonding technology. ◆ We are currently offering materials that summarize test results and technical data for various materials. Please check the "PDF Download" below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Explanation material "What is Diffusion Bonding?" *Free Gift

We are offering a free document that explains the features and methods of "diffusion bonding," a technology for joining metals without melting them! A must-see for manufacturing beginners!

Since our establishment, we have been working to adapt diffusion bonding technology for mass production, and we are pleased to present a detailed explanation of "diffusion bonding" from our company! The diffusion bonding we conduct is a solid-state bonding technique that joins metals without melting them, which broadens the range of feasible products and functions. For example: - High-pressure, compact, and high-performance heat exchangers (such as those for hydrogen stations) - Water-cooled heat sinks capable of uniform cooling - Vapor chambers (sheet-type heat pipes) that can diffuse localized heat input in a planar direction - Microreactors that efficiently mix minute amounts of two fluids Through the realization of fine and complex structures, we have been working on miniaturization and high performance. Please feel free to consult us, especially for any heat-related issues. This document clearly explains the principles, methods, and features of diffusion bonding! It is designed to be easy to read, even for beginners in manufacturing, using diagrams and photos. You can download the document immediately from "PDF Download." We encourage you to take a look! 【Contents】 - What is diffusion bonding? - Methods of diffusion bonding - Features of diffusion bonding

Company：WELCON 本社
Price：Other

Heat exchanger
Other electronic parts
air conditioning

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Diffusion bonding

Join dissimilar metals through atomic interdiffusion between materials! Manufacturing of hollow components is possible!

"Diffusion bonding" is a method that involves cleaning the surfaces to be joined, heating the materials above the recrystallization temperature in a high vacuum or inert atmosphere, and applying a relatively small pressure to achieve bonding through atomic diffusion between the materials. This method results in minimal deformation during bonding, making it suitable for joining precision components. Additionally, it allows for surface bonding and layering. Please feel free to contact us when you need our services. 【Features】 ■ Capable of joining dissimilar metals ■ Capable of manufacturing hollow components ■ Minimal deformation during bonding, suitable for precision component joining ■ Surface bonding and layering are possible *For more details, please refer to the PDF materials or feel free to contact us.

Company：戸畑製作所
Price：Other

Contract manufacturing
Welding Machine

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Yamatec Co., Ltd. "Diffusion Bonding Comprehensive Catalog"

A comprehensive catalog introducing "diffusion bonding," which joins materials without melting the base material.

The "Diffusion Bonding Comprehensive Catalog" by Yamatech Co., Ltd. introduces the method of "diffusion bonding," which involves closely adhering base materials and applying pressure to a degree that minimizes plastic deformation at temperatures below the melting point of the base materials, utilizing the diffusion of atoms that occurs between the bonding surfaces. It also includes examples of applications of diffusion bonding, diffusion bonding using vacuum hot pressing, and illustrations showing how the bonding interface integrates over the course of diffusion bonding. 【Benefits of Diffusion Bonding】 ○ Bonding of surfaces ○ Precision machining possible at the micron (μm) level ○ Capable of handling products from small-sized to large-sized ○ Enables the manufacturing of complex structural parts that were previously impossible to create For more details, please contact us or download the catalog.

Company：ヤマテック
Price：Other

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Titanium, nickel, aluminum, and stainless steel are also acceptable [diffusion bonding (thermal pressing)].

Yamatec has achieved numerous results with materials other than SUS, and titanium, nickel, aluminum, and stainless steel are also acceptable! Technical materials are also available!

At Yamatec, we have achieved numerous results and provide stable technology with materials other than SUS, which are said to be difficult by other companies. Starting with "stainless steel (SUS)", we also work with "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", and "titanium (Ti)". Additionally, we have many achievements in the joining of dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. 【Metals that can be joined at Yamatec (partial list)】 ■ Stainless steel (SUS) ■ Nickel-based (Ni) ■ Copper-based (Cu) ■ Aluminum (Al) ■ Titanium (Ti) *For more details, please refer to the PDF materials or feel free to contact us.

Company：ヤマテック
Price：Other

Contract manufacturing
Mold Design
Other molds

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[New Technology] Contributing to the High Strength of Joints 'CORE-X Technology'

Joinable without losing material properties or melting the joint interface! Technical documentation is currently being distributed.

"CORE-X Technology" is a new technology that enables high-strength bonding for assemblies created through diffusion bonding. It allows for bonding without melting the joint interface and does not compromise material properties. Additionally, post-bonding processing and heat treatment can be performed without issues. 【What CORE-X Technology can achieve】 - High-strength bonding across the entire joint surface - Bonding without melting the joint interface - Bonding that retains material properties - Capability for post-bonding processing and heat treatment - Simultaneous bonding of multiple cross-sections is possible (Note: Bonding characteristics are influenced by alloy components) *For detailed information about the technology, please download the PDF document from the link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Interface observation of diffusion bonding using CORE-X technology: A case study of cold work die steel.

A new technology that combines diffusion bonding to enhance the strength of joints and significantly reduce voids. Verification of interfacial observation results using SKD11 (cold work die steel)!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for our "diffusion bonding" and combine it with our new technology "CORE-X technology" to enhance the strength of the bonded area and significantly reduce voids. [Test Results with SKD11 (Cold Work Die Steel)] In the case of conventional diffusion bonding alone, there were many voids and insufficient strength; however, by applying "CORE-X technology" along with quenching, we achieved high strength. Furthermore, in the fracture test, no fractures occurred at the joint, demonstrating high strength. ◆ Please also take a look at the photo in the top left corner of the page! ◆ We are currently offering a document summarizing test results and technical data for various materials. Please check it out via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Interface observation of diffusion bonding using CORE-X technology: A case study of powder steel.

A new technology that enhances the strength of joints and significantly reduces voids. Verification of interface observation results using ELMAX (powder steel)!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for our "diffusion bonding" and combine it with our new technology, "CORE-X technology," to enhance the strength of the bonded area and significantly reduce voids. 【Test Results with ELMAX (Powder Steel)】 In cases of conventional diffusion bonding alone, there were many voids and insufficient strength; however, by applying "CORE-X technology" along with quenching, we achieved high strength. Additionally, in fracture tests, no fractures occurred at the bonding area, demonstrating high strength. ◆ Please also take a look at the photo in the upper left corner of the page! ◆ We are currently offering a document summarizing test results and technical data for various materials. Please check it out via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Joining of dissimilar materials using CORE-X technology: Case of S45C + Cu

A new technology that strengthens the bonding between different materials and significantly reduces voids. Verification of dissimilar material joints using S45C + Cu!

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for "diffusion bonding," and by combining it with our new technology "CORE-X technology," we can achieve high strength at the joint when bonding dissimilar materials and significantly reduce voids. The photo at the top left of this page shows the bonding of S45C and Cu using our technology. The bonding surfaces are closely adhered, demonstrating high strength. ◆ We are currently offering a document summarizing test results and technical data for various materials. Please view it via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Strength test of joints using CORE-X technology: Test results with alloy tool steel.

A new technology that enhances the joint parts of the composite to high strength and significantly reduces the gaps. This introduces the results of strength tests conducted on cut specimens of alloy tool steel (DAC) composites.

At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between bonding surfaces for our "diffusion bonding," and by combining it with our new technology "CORE-X technology," we can enhance the strength of the bonded joints and significantly reduce voids. 【Strength tests conducted on cut test pieces of DAC bonded joints!】 Photos of the test results are posted in the upper left of this page. Even when the test pieces are bent or twisted, there was no fracture at the bonding parts, demonstrating the high strength of our bonding technology. ◆ We are currently offering a document summarizing test results and technical data for various materials. Please check it out via the "PDF Download" link below.

Company：MOLE'S ACT（モールズアクト）
Price：Other

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Realization of microchannel structure

It is possible to stack and join accurately, allowing for holes to be penetrated! Pressure loss can be controlled.

Our company has a high alignment accuracy that enables the precise realization of microchannel structures. Even when stacking 300 plates with a honeycomb hole structure ranging from 250μm to 800μm, it is possible to stack and bond them accurately, allowing for the holes to be continuous. We will consider an optimal internal structure design based on the specifications. Please feel free to contact us when needed. 【Microchannel Features】 ■ Contributes to reducing both diameter and flow path length ■ By controlling the convergence of both parameters, overall pressure loss can also be controlled ■ If the flow rate is constant, pressure loss can be controlled *For more details, please refer to the PDF document or feel free to contact us.

Company：WELCON 本社
Price：Other

Heat exchanger
Other electronic parts
air conditioning

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Diffusion bonding (thermal pressing) *Free comprehensive technical catalog available!

Unlike welding, it is a processing technology suitable for manufacturing high-precision and finely sized parts without melting the base material!

Yamatec Co., Ltd.'s "Diffusion Bonding (Thermal Press Joining)" is a processing technology that utilizes the diffusion of atoms occurring between the bonding surfaces by closely adhering the base materials and applying pressure to the extent that plastic deformation occurs as little as possible under temperature conditions below the melting point of the base materials. Unlike welding, it joins without melting the base materials, making it suitable for the manufacturing of products that require high precision and small-sized components. Additionally, since it does not use adhesives, there are no issues such as gas generation or the need to clean excess parts. **Advantages of Diffusion Bonding** - Surface-to-surface bonding → No worries about peeling during post-processing (tapping, embossing, bending, etc.)! - Precision processing at the micron (μm) level is possible → Established technology for layering and bonding precision components created by photo-etching without misalignment or distortion! - Capable of accommodating various sizes and shapes, including miniaturization and precision → Enables bonding of up to 1000×1000mm! - Capable of manufacturing complex parts that could not be made before → Can create complex shapes and flow structures that are difficult to achieve with metal processing such as cutting! *For more details, please contact us or download the catalog (technical materials).*

Company：ヤマテック
Price：Other

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Plastic processing machines (cutting and rolling)

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